Collaborative AI · Process control software

From industrial data
to process understanding.

Smart3 connects your data, expertise and AI, from R&D to production.

Wafer maps · Analysis results
Control processes
SEM · 3D nanowires
TEM · Photonic waveguide cross-section
Understand structures
Substrate
Deposition
Patterning
Etching

Smart3 connects your data, from R&D to production.

↗ On-premise deployment↗ Your data, your infrastructure↗ Your algorithms, your intellectual property↗ R&D → Production
Smart3 Software Platform

One platform. Your expertise. All your data.

Smart3 brings together the data involved in manufacturing innovative materials, organized into six broad categories.

ImagesPoint cloudsDesignsSpectraTime seriesTabular data

On-premise installation. Data confidentiality for every customer.

Smart3 runs on your infrastructure: you retain control of your data and know-how, from R&D to production.

Smart3Collaborative AI Platform
01

Connect

Multi-source data

02

Analyze

Workflows · AI · Simulation

03

Decide

Measurements · Defects · Processes

Your gains with Smart3

Improve yield.
Accelerate equipment innovation.

Two industrial challenges, one platform to turn data into value.

Fabs & fabless

Control processes and improve yield

Total cost: a better balance

Use more data while reducing overall cost.

Lower costsRelative costMetrology data used →
Without PollenWith Pollen
  • Faster root cause analysis
  • Better control of process windows
  • Lower losses and improved yield

Equipment makers

Create more value around your equipment

More value, less shared software development

Create your own IP on Smart3 and retain ownership of your developments.

Without PollenBuild everything
Software foundation
Data & connectors
Business applications
Maintenance
With PollenDifferentiate
Your IPYour expertiseApplications & algorithmsIntellectual property created and retained by you.
Smart3 · Foundation maintained by Pollen
  • Faster time to market
  • Less shared software development and maintenance
  • Resources focused on your added value
Explore the two OEM & SDK integration paths →

Conceptual comparisons: gains depend on data, processes, integration scope and use cases.

Smart3 · Capabilities

One software platform.
Capabilities that work together.

Smart3 combines your data and analytical capabilities in one environment: metrology, inspection, simulation and optimization work together to understand your materials and processes.

Smart3 SEM/TEM metrology interface

Metrology & characterization

Extract measurements and characterize structures using multi-source data.

Smart3 defect classification interface

Inspection & defect analysis

Detect, segment and classify defects within your industrial context.

Simulation and digital twin interface

Simulation & process optimization

Connect experimental data, manufacturing parameters and physics-based models to inform decisions.

Smart3 · Natural-language customization

Turn your expertise into a workflow.
Without writing code.

Describe your needs in natural language. With an LLM and documentation context supplied through RAG, create data readers and combine your plugins in Smart3.

Describe → Create → Compose

Watch the AFM & EBSD demo ↓
Smart3 · Simulation & experimental data

Simulation meets real-world data.
A continuous learning loop.

Simulation becomes more useful when tested against reality. Smart3 connects simulation tools with characterization data to compare results, refine models and guide the next experiments.

Illustrated example: plasma etching — from simulation to SEM/TEM cross-sections and measurements in Smart3. The same loop also applies to other processes, substrates, components and materials.

05Simulation & optimization
Illustrative plasma etching simulation example
04Results & analysis
Frame from the Smart3 video: cross-sections of etched structuresFrame from the Smart3 video: structure analysis and measurements
Smart3Data · Models · DecisionsWafers · Substrates · Materials
01DOE & recipes
02Process
03Characterization
04Results & analysis
05Simulation & optimization
02Process
Illustrative process tool with FOUPs on integrated load ports
03Characterization
Illustrative characterization instrument
  1. 01

    DOE · Design of experiments

    Define objectives, factors and experimental conditions.

  2. 02

    Process

    Run experiments using the selected recipes and parameters.

  3. 03

    Characterization

    Measure structures, materials and defects using SEM, TEM, AFM and other sources.

  4. 04

    Results & analysis

    Connect measurements with parameters, compare performance and investigate discrepancies.

  5. 05

    Simulation & decisions

    Compare models with reality, explore scenarios and guide the next DOE.

Back to DOE: each cycle informs the models and helps select the next experiments. Smart3 connects data and tools throughout this loop.

Improve yields

Connect measurements with parameters to identify performance drivers.

Accelerate development

Focus experiments and connect simulation with experimental data.

Reduce manufacturing costs

Automate analysis and make better use of data to guide decisions.

Your journey with Pollen

From your first use case to deployment.

LEARNPollen Academy1–3 days

Train your teams and explore your data.

DISCOVER 2–3 months

Assess a focused use case and its feasibility.

EXPLORE 6 months

Develop and validate your application.

DEPLOY 12 months

Integrate and deploy in production.

TRANSFORM Ongoing

Expand applications and continuously improve.

Working with Pollen

A transparent model, tailored to your needs.

Start with a concrete application, then expand Smart3 as your needs evolve. Your proposal clearly separates licenses and services, with scope and costs agreed together.

Licenses sized for your deployment

Based on the number of licenses and how they are used: R&D teams, production sites or integration into your equipment.

The level of service you need

Training, support and custom development: we tailor our involvement to your resources and your goals for autonomy.

A gradual, controlled expansion

From your first project to broader deployment, you have visibility into the costs of each stage.

Local partners

Support closer to you.

Japan

Keisoku Engineering System Co., Ltd.

Your local partner in Japan to discuss Smart3 and your applications.

Visit the KESCO website ↗Website currently under maintenance.
South Korea

Woowon Technology Co., Ltd.

Your local distributor in South Korea to discuss Smart3 and your applications.

Visit the Woowon website ↗
Industries

Intelligence for your industrial environment.

Semiconductors

From process development to production monitoring: make use of metrology and inspection data.

Advanced packaging

Analyze structures, interconnects and defects. Connect characterization data to manufacturing parameters.

Displays & photonics

Characterize microLEDs and optical structures. Bring measurements and simulation together.

Advanced materials

Build analysis workflows to understand the relationships between structure, properties and process.

Fab illustration from the Pollen presentation
Smart3

In your fab

Connect data, analyze results and guide process decisions.

Smart3 Data · AI · Workflows · SDK
Equipment illustration from the Pollen presentation
Smart3

In your equipment

Integrate your algorithms and enhance your tools’ capabilities.

Smart3 · OEM & SDK

One platform. Two integration paths.

Save years of software development.

Fabs, fabless companies and equipment suppliers: build your domain applications on Smart3, an open, customizable and unified software platform.

Build on ten years of core technology development to integrate your data, algorithms and workflows while retaining your know-how and differentiation.

One platform, from R&D to production.

Harmonize tools and methods across teams, instruments and sites.

Focus resources on your added value.

Concentrate on data science, processes and the applications that set you apart.

Reduce software infrastructure costs.

Limit cross-cutting development and proprietary platform maintenance with a common software foundation maintained and enhanced by Pollen.

On-premise deployment, in your environment.

Whether deployed in a fab or integrated into equipment, Smart3 runs on your infrastructure. Data confidentiality remains central to every deployment.

Savings extend beyond time: shared platform development, maintenance, testing and software infrastructure help reduce your total cost over time.

About Pollen

Data science.
Industrial reality.

Founded in Grenoble in 2014 and based in Moirans since 2015, Pollen grew out of fifteen years of research by its founder, Johann Foucher, at CNRS and CEA in plasma physics for semiconductor etching and advanced metrology.

One conviction guides Smart3: understanding processes requires connecting data and making analysis customizable. Our open software platform combines experimental data, domain expertise and simulation within a holistic view of processes.

From a scientific vision to collective expertise.

From 2015 to 2024, ten years of development built the Smart3 core and a multidisciplinary team spanning software, AI, signal processing, semiconductors, materials characterization, physics and chemistry.

Today, this collective expertise translates into practical applications for industrial customers and equipment suppliers in the United States, Europe and Asia, from R&D to production.

The management team behind Smart3

Our management team

Ali Hallal (PhD)

Ali Hallal (PhD)

Team Leader Application & Support

LinkedIn ↗
Smart3 · In action

See Smart3 in action.

Pollen news

Pollen highlights

Pollen JNPack 2026 visual with Richard Fontanges

From packaging data to operational decisions

Pollen at the 3rd National Packaging Days, held on 13–14 October 2026 at CEA-Leti in Grenoble. Richard Fontanges presented how Smart3 connects images, measurements, process data and defects to guide engineering decisions.

View on LinkedIn ↗
GT CICERIF — Valeo — 7 septembre 2026 — FdEF

CICERIF working group: advancing sustainable electronics

A look back at the CICERIF working session at Valeo, focused in particular on FALAISE — Failure AI for Sustainable Electronics. A collective initiative of the French Electronics Federation around innovation and sustainable electronics.

View the FdEF post ↗
The Pollen team together in the mountains on 8 July 2026

One team, a shared ambition and a milestone together

A day in the mountains to celebrate a new milestone for Pollen and thank the team, customers and partners. Hiking, lunch at Altitude 2000 and time together celebrating what makes the journey possible: trust, passion and teamwork.

View on LinkedIn ↗
Pollen & STMicroelectronics — PESM 2026 — Augmented Engineer — Julien Baderot

PESM 2026: connecting plasma simulation and real-world processing with STMicroelectronics

Presented by Julien Baderot in Grenoble, collaborative Pollen–STMicroelectronics research on FDSOI gates combines AI-based automated TEM metrology, digital twins and multi-objective plasma etching optimization to accelerate the identification of process windows.

View on LinkedIn ↗
Papers

The science behind Smart3.

Explore six selected publications and an outside perspective on Pollen. Metrology, defect analysis, open platforms and process optimization: research rooted in industrial applications.

Featured · SemiWiki

A decade of development, an AI platform deployed in industry

Lauro Rizzatti explores the development of Smart3 and its role in connecting data, equipment and engineering expertise across semiconductors and advanced materials.

Lauro Rizzatti ·

Read on SemiWiki ↗

Our selection

SPIE · 2026Published

Infinitesima

Large-scale AFM image stitching

Combine high-speed AFM scans into large-area maps and analyze them in Smart3, in collaboration with Infinitesima.

View publication ↗
Full reference

Advancements and challenges in large-scale atomic force microscopy image stitching for semiconductor devices

Authors
Julien Baderot, Ali Hallal (Pollen); Matthew Tedaldi, Richard Thomas, Andrew D. L. Humphris (Infinitesima); Johann Foucher (Pollen)
Publication / conference
SPIE Advanced Lithography + Patterning 2026, Metrology, Inspection, and Process Control XL (Proc. SPIE)
EMLC / SPIE · 2024Published

Metrospection: metrology meets inspection

Combine measurements and defect detection, from patterns to wafers, in an open platform configured by the engineer.

View publication ↗
Full reference

Metrospection: holistic AI-driven process control software platform dedicated to metrology and defectivity for patterning process at die and wafer levels

Authors
Julien Baderot, Ali Hallal, Martin Jacob, Sergio Martinez, Johann Foucher (Pollen)
Publication / conference
39th European Mask and Lithography Conference (EMLC 2024), Proc. SPIE 13273, 132731J
SPIE · 2026Published

Open AI platform and digital twin

Connect data cleaning, modeling and process optimization while retaining the ability to integrate proprietary algorithms.

View publication ↗
Full reference

Open collaborative AI platform to support process optimization for semiconductor industry with digital twin

Authors
Julien Baderot, Marion Grould, Ali Hallal, Johann Foucher (Pollen)
Publication / conference
SPIE Advanced Lithography + Patterning 2026, DTCO and Computational Patterning V (Proc. SPIE)
PESM · 2026Conference abstract and talk

STMicroelectronics

Augmented Engineer: plasma simulation and real data

A no-code AI layer to help engineers connect simulation with process data and explore optimization trade-offs, with STMicroelectronics.

View reference ↗
Full reference

Augmented Engineer: A No-Code AI Application Layer for Bridging the Gap Between Plasma Simulation and Real-World Processing

Authors
Julien Baderot, Marion Grould (Pollen); Caroline Lacomme, Linda Parmigiani (STMicroelectronics); Ali Hallal, Hervé Ozdoba, Johann Foucher (Pollen)
Publication / conference
PESM 2026 (Plasma Etch and Strip in Microelectronics), June 2026, oral presentation
SPIE Photomask · 2024Published

Meta

Adaptable metrology for AR/VR structures

Measure slanted gratings in TEM and structures in CD-SEM with workflows that evolve alongside Meta’s process development.

View publication ↗
Full reference

Scalable and adaptable structural metrology for AR/VR device images based on deep learning

Authors
Subhei Shaar, Maclean Harned, Bo Zhao, Kundan Chaudhary, Raja Muthinti (Meta); Ali Hallal, Martin Jacob, Julien Baderot, Sergio Martinez, Johann Foucher (Pollen)
Publication / conference
SPIE Photomask Technology 2024, Proc. SPIE 13216, 132161H
JVST B · 2022Journal article

Deep-learning metrology on SEM/TEM images

The foundations of Pollen’s AI metrology: annotation, detection, segmentation and measurements from user-provided examples.

View publication ↗
Full reference

Application of deep-learning based techniques for automatic metrology on scanning and transmission electron microscopy images

Authors
J. Baderot, M. Grould, D. Misra, N. Clément, A. Hallal, S. Martinez, J. Foucher (Pollen)
Publication / conference
Journal of Vacuum Science & Technology B 40, 054003 (2022)
Build with us

Which process would you like to improve?

Tell us about your data, application and objectives. Together, we will define a practical first step.

Pollen

122 rue Rocher de Lorzier
38430 Moirans, France

LinkedIn ↗

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